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QCW fiber laser micro-cutting and drilling system

Industry application:

High-grade ceramic substrate printed circuit board (PCB) shape cutting, hole, blind hole drilling, such ceramic substrate drilling, cutting; high-temperature and wear resistant automobile electric circuit board, precision ceramic gears and appearance component cutting and precision metal gear and structural parts cutting, drilling.

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Name:QCW fiber laser micro-cutting and drilling system   Model:Super-Drilling 600F


  Technical specifications :

 

parameter                                                        Model

Super-Drilling 600F

Type of laser

 1064nm或10.64um Optional

Maximum laser power

 200-500W Optional

Maximum working range of laser processing

 600mm×600mm Arbitrary automatic stitching hole cutting

Laser minimum spot

 40um

Precision of laser processing line

 ≤±3um

Laser processing speed

 0-3000mm/S Adjustable

Maximum moving speed of XY platform

 800mm/S   1G acceleration

CCD positioning accuracy

 ≤±2um

Repeated precision of XY platform

 ≤±1um

Positioning accuracy of XY platform

 ≤±3um

Whole machine power supply

 5kw/Ac220V/50Hz

Cooling mode

 Constant temperature water cooling

Overall size

 1600×1398×1800mm

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Hits:  UpdateTime:2016-05-27 11:58:53  【Printing】  【Close