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HDI high speed laser drilling system

Industry application:

High-grade ceramic substrate printed circuit board (PCB) shape cutting, hole, blind hole drilling, such ceramic substrate drilling, cutting; high-temperature and wear resistant automobile electric circuit board, precision ceramic gears and appearance component cutting and precision metal gear and structural parts cutting, drilling.

Name:HDI high speed laser drilling system

Model:SLDr-8070I

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Technical specifications:

 

parameter               Model

 SLDr-8070I

Type of laser

 1064nm or 10.64um Optional

Maximum laser power

 200-500W Optional

Maximum working range of laser processing

 600mm×600mm Arbitrary automatic stitching hole cutting

Laser minimum spot

 40um

Precision of laser processing line

 ≤±3um

Laser processing speed

 0-3000mm/S Adjustable

Maximum moving speed of XY platform

 800mm/S   1Gacceleration

CCD positioning accuracy

 ≤±2um

Repeated precision of XY platform

 ≤±1um

Positioning accuracy of XY platform

 ≤±3um

Whole machine power supply

 5kw/Ac220V/50Hz

Cooling mode

 Constant temperature water cooling

Overall size

 1600×1398×1800mm



Sample picture:

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Hits:  UpdateTime:2016-05-27 13:35:25  【Printing】  【Close