Focused on micro-electronics industry Picosecond & femtosecond micro-cutting·drilling·etching·scribing system
  • English
  • Japanese
  • Chinese
Home > Application

HDI high speed laser drilling system

Industry application:

High-grade ceramic substrate printed circuit board (PCB) shape cutting, hole, blind hole drilling, such ceramic substrate drilling, cutting; high-temperature and wear resistant automobile electric circuit board, precision ceramic gears and appearance component cutting and precision metal gear and structural parts cutting, drilling.

Name:HDI high speed laser drilling system



Technical specifications:


parameter               Model


Type of laser

 1064nm or 10.64um Optional

Maximum laser power

 200-500W Optional

Maximum working range of laser processing

 600mm×600mm Arbitrary automatic stitching hole cutting

Laser minimum spot


Precision of laser processing line


Laser processing speed

 0-3000mm/S Adjustable

Maximum moving speed of XY platform

 800mm/S   1Gacceleration

CCD positioning accuracy


Repeated precision of XY platform


Positioning accuracy of XY platform


Whole machine power supply


Cooling mode

 Constant temperature water cooling

Overall size


Sample picture:


Hits:  UpdateTime:2016-05-27 13:35:25  【Printing】  【Close