Focused on micro-electronics industry Picosecond & femtosecond micro-cutting·drilling·etching·scribing system
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Micro precision cutting and drilling system
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Automatic picosecond laser wafer scribing machine
Automatic picosecond laser wafer scribing machine
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Model:Honor series 6040


Wafer scribing samples:

2016042814421692573.jpg

Industry application:  

Semiconductor IC circuit, such as single or double glass passivated silicon wafer, single or double polished silicon wafer , GaAs, GaN, IC wafer.

 

The machine advantages:

1Picosecond laser, customized focus module, cutting width of 10μm, narrow kerf width, beam diameter of ~3 μm, high yield,  no thermal effect, no damage to chip circuit.

2、The speed of scribing can be up to 500mm/s, one-time cutting for the glass with thickness less than 1 mm.

3、CCD visual homing target, one-time process  650mm×450mm, and the stitching precision of XY platform  less than 3μm.

4、No taper cutting, the minimum chipping of 3μm, smooth edges.

5、The system supports multiple visual positioning characteristics, such as cross, solid round, hallow circular, L square edge、visual image feature point, etc.

68-years laser microprocess technology research and accumulation, stable performance and 20000 hours work without consumables.

7、Automatic feeding and blanking system, save labor cost.

 

Picoseconds laser scribing principle (Transparent material burst cutting with focus inside) :

      With Bessel or DOE  optical systems, the Gauss beam is compressed to the diffraction limit, so a laser beam with high repetition frequency of 100~200kHz and  short pulse width of 10ps is compressed to a very small area of diameter 3μm,that is to say, the compressed beam has a so high peak power density that can focus in the center of transparent material , instantly gas material and produces a gasification zone, which spreads to the upper and lower surfaces to form cracks, achieving separation of material. Picosecond & Femtosecond laser scribing process is the future program of brittle materials, including glass, sapphire and Si (transparent for IR).

 

 

                                                       Technical specifications 


No.

Items

Specifications

Optical unit

1

Laser device

1064nm 10ps 200KHz

2

Cooling mode

Constant temperature water cooling

3

Laser power

50W

4

Beam quality

M²<1.3

5

Focusing method & processing head

One-point focusing lenssingle-head

6

Minimum focusing speckle diameter

Ф3μm

Laser processing properties

7

Processing speed

100-1000mm/s adjustable

8

Minimum chipping

3μm

9

Maximum processing thickness

1mm

10

Maximum processing size & precision

12 inches,±5μm

Machine unit

11

Machine tool structure

Gantry

12

Numbers of axles and types of machine tool

Max.8,X,Y,Z & θ axle

13

Maximum journey & speed of operating platform

650mm×450mm,1000mm/s

14

Repetition accuracy of moving platform

≦±1μm

15

Positioning accuracy of moving platform

≦±3μm

Software control unit

16

Laser processing & platform control

Strongsoft, Strongcut

17

Lead-in format of processing file

Dxf, Plt, DWG, Gebar

18

CCD visual positioning software

AISYS Vision

19

CCD visual positioning accuracy

≦±3μm

Electric unit

20

PLC Controller

Panasonic

21

Vacuum system

Vacuum pump

22

Dedusting & dust-collecting system

Professional dust filter integrated machine

Automatic unit

23

Automatic loading & laying -off system

X/Z axle+movable platform

Installation environment

24

Power supply & regulator power

220V/380V, 6KW

25

Pressure of compressed air

0.6MPa

26

Rank of clean room

10000

27

Ground bearing

 2T/m²

28

Protect nitrogen

High purity nitrogen



Business department head:


Mr ye 15989909231


E-mail :yf@stronglaser.com


Hits:  UpdateTime:2016-07-07 08:53:19  【Printing】  【Close

Business department head:


Mr ye 15989909231


E-mail :yf@stronglaser.com