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Micro precision cutting and drilling system
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Brittle material picosecond laser micro-cutting system
Brittle material picosecond laser micro-cutting system
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Model:Super-Dmicro650


Cutting and slotting samples

2016042814421692573.jpg

 

Industry application:

Micro drilling and cutting for cover plate of mobile phone, optical glass, sapphire, semiconductor package chips,  ceramic substrate. Specific industry application such as:

(1)Phone plate and optical lens cutting

(2)Fingerprint identification chips cutting

(3)Optical lens cutting

(4)LCD panel cutting

(5)Organic & inorganic flexible display circuit etching & cutting

 

The machine advantages:

1、Picosecond laser or Femtosecond laser with ultrashort pulse and no heat conduction, is suitable for high-speed cutting and drilling of any organic & inorganic materials,  achieving the minimum chipping or the heat-affected zone less than 10μm.

2One laser source with beam split technology, dual laser head processing with efficiency doubled.

3CCD visual homing target, one-time process 650mm×450mm, and the stitching precision of XY platform  less than 3μm.

4The system supports multiple visual positioning characteristics, such as cross, solid round, hallow circular, L square edgevisual image feature point, etc.

5Automatic cleaning, visual detection and sorting, automatic feeding and blanking.

68-years laser microprocess technology research and accumulation, stable performance and no consumables.

 

Picosecond laser surface melting cutting principle:

A laser beam with the movement of the scanning galvanometer, and also through a convex lens focusing, can focus on the surface of the brittle material, and repeating the circle movement, etching material gradually, during that time, material is instantly heated to gasification temperature, and to escape from the material surface in the form of gas,  thus finish cutting and separation process.

                                                 Technical specifications 


No.

Items

Specifications

Optical unit

1

Laser device

3555321064nm optional

2

Cooling mode

Constant temperature water cooling

3

Laser power

10-100W

4

Beam quality

M²<1.3

5

Focusing method & processing head

F-Theta focusing lensdual-head

6

Minimum focusing speckle diameter

Ф15μm

Laser processing properties

7

Processing speed

100-1500mm/s adjustable

8

Minimum chipping

15μm

9

Maximum processing thickness

1mm

10

Maximum processing size & precision

250mm×250mm,±5μm

Machine unit

11

Machine tool structure

Gantry

12

Numbers of axles and types of machine tool

Max.8,X,Y,Z & θ axle

13

Maximum journey & speed of operating platform

650mm×450mm,800mm/s

14

Repetition accuracy of moving platform

≦±1μm

15

Positioning accuracy of moving platform

≦±3μm

Software control unit

16

Laser processing & platform control

Strongsoft, Strongsmart

17

Lead-in format of processing file

Dxf, Plt, DWG, Gebar

18

CCD visual positioning software

AISYS Vision

19

CCD visual positioning accuracy

≦±3μm

Electric unit

20

PLC Controller

Panasonic

21

Vacuum system

Vacuum generator

22

Dedusting & dust-collecting system

Triple phase electric blower fan

Automatic unit

23

Automatic loading & laying -off system

X/Z axlemovable platform

Installation environment

24

Power supply & regulator power

220V/380V, 5KW

25

Pressure of compressed air

0.6MPa

26

Rank of clean room

10000

27

Ground bearing

 2T/m²

28

Protect nitrogen

High purity nitrogen


Business department head:


Mr wu 13686046555


E-mail:wcy@stronglaser.com


Hits:  UpdateTime:2016-07-06 08:54:15  【Printing】  【Close

Business department head:


Mr wu 13686046555


E-mail:wcy@stronglaser.com