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Micro-maching complete station
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Picosecond laser micromaching system
Picosecond laser micromaching system
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Model:Honor series6541


Cutting and drilling samples:

盛雄激光-2.jpg

    Ceramic           Glasses           flexible ceramic   small holes 

    



    

Industry application:

Micro drilling and cutting for cover plate of mobile phone, optical glass, sapphire, semiconductor package chips, ceramic substrate. Specific industry application such as:

(1)Phone plate and optical lens cutting

(2)Semiconductor IC chips cutting

(3)Optical lens cutting and drilling

(4)Precision sensor micro-drilling

(5)Precision gear cutting

(6)Automobile engine nozzle micro-drilling

(7)LCD panel cutting

(8)Organic & inorganic flexible display circuit etching and cutting


The machine advantages:

1、Picosecond laser or femtosecond laser with ultrashort pulse and no heat conduction, is suitable for high-speed cutting and drilling of any organic & inorganic materials, achieving the minimum chipping and heat-affected zone less than 3μm.

2、One laser source with beam split technology, dual laser head processing with efficiency doubled.

3、CCD visual homing target, one-time process 650mm×450mm, and the stitching XY platform less than 3μm.

4、The system supports multiple visual positioning characteristics, such as cross, solid round, hallow circular, L square edge、 visual image feature point, etc.

5、Automatic cleaning, visual detection and sorting, automatic feeding and blanking.

6、8-years laser micro-process technology research and accumulation, key components selected from world famous manufacturers, 7×24 hours of continuous work without failure, with higher actual production capacity.


                                                         

                                                             Technical specifications 


No.

Items

Specifications

Optical unit

1

Laser device

355、532、1064nm optional 10ps

2

Cooling mode

Constant temperature water cooling

3

Laser power

10-100W

4

Beam quality

M²<1.3

5

Focusing method & processing head

One-point & F-Theta focusing lensdual-head

6

Minimum focusing speckle diameter

Ф3-15μm

Laser processing properties

7

Processing speed

100-300mm/s adjustable

8

Minimum chipping

3μm

9

Maximum processing thickness

2mm

10

Maximum processing size & precision

12inches,±5μm

Machine unit

11

Machine tool structure

Gantry

12

Numbers of axles and types of machine tool

Max.8,X,Y,Z & θ axle

13

Maximum journey & speed of operating platform

650mm×450mm,800mm/s

14

Repetition accuracy of moving platform

≦±1μm

15

Positioning accuracy of moving platform

≦±3μm

Software control unit

16

Laser processing & platform control

Strongsoft, Strongsmart

17

Lead-in format of processing file

Dxf, Plt, DWG, Gebar

18

CCD visual positioning software

AISYS Vision

19

CCD visual positioning accuracy

≦±3μm

Electric unit

20

PLC Controller

Panasonic

21

Vacuum system

Vacuum pump

22

Dedusting & dust-collecting system

Professional dust filter integrated machine

Automatic unit

23

Automatic loading & laying -off system

X/Z axlemovable platform

Senior optional unit

24

AOI visual inspection

8-12 big hunk 12inches/3min

25

Automatic slivering

8-12 big hunk 12inches/3min

26

Automatic cleaning and sorting

8-12 big hunk 12inches/3min

Installation environment

27

Power supply & regulator power

220V/380V, 8KW

28

Pressure of compressed air

≥0.6MPa

29

Rank of clean room

10000

30

Ground bearing

 2T/

31

Protect nitrogen

High purity nitrogen


Business department head


Mr tao13326864005


E-mail:txb@stronglaser.com


Hits:  UpdateTime:2016-07-08 08:52:02  【Printing】  【Close

Business department head


Mr tao13326864005


E-mail:txb@stronglaser.com