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Micro precision cutting and drilling system
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High-speed laser micro-drilling system
High-speed laser micro-drilling system
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Model:SLDr-8070i


Drilling samples:Dmin=Φ10μm  Speed=2000holes/s T=100μm

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Industry application:

1, HDI drilling PCB industry

2, Ceramic chip inductor drilling

3, Semiconductor micro-electronics TSV micro-drilling

4, Automobile engine nozzle micro-drilling

 

The machine advantages:

1The system using picosecond laser without heating effect, is suitable for ultrafast drilling of ceramic film.

2One laser source with beam split technology, dual laser head processing with efficiency doubled.

3The maximum speed of drilling is as high as 2000 holes/s, and the minimum diameter of hole is 10μm, with smooth edge and roundness>95% .

4CCD visual homing target, one-time process 650mm×450mm, and the stitching precision of XY platform  less than 3μm.  

5The system supports multiple visual positioning characteristics, such as cross, solid round, hallow circular, L square edge, visual image feature point, etc.

6Full automatic process with unattended operation.

78-years laser micro-process technology research and  accumulation, stable performance and no consumables.

 

Picosecond laser micro-drilling principle:

   High peak-power picosecond laser with single-pulse accumulation or multi-pulse spiral movement,  conducts the huge energy to the workpiece in a short period of time, and makes workpiece material instantly melting and evaporation. The higher the pulse energy, the much more material will melt and evaporate. In the process of evaporation, the volume of material in the holes increase so dramatically that produce a high pressure which will explode the deteriorated material out of the holes, leaving smooth holes without thermal effect.  Compared with CO2 laser drilling , picosecond laser drilling has a more clean edge.

                                                

                                                     Technical specifications 


No.

Items

Specifications

Optical unit

1

Laser device

3551064nm optional

2

Cooling mode

Constant temperature water cooling

3

Laser power

10-100W

4

Beam quality

M²<1.3

5

Focusing method & processing head

F-Theta focusing lensdual-head

6

Minimum focusing speckle diameter

Ф8μm

Laser processing properties

7

Processing speed

Single -head 2000holes/s

8

Minimum chipping

1.5μm

9

Maximum processing thickness

0.5mm

10

Maximum processing size & precision

250mm×250mm,±3μm

Machine unit

11

Machine tool structure

Gantry

12

Numbers of axles and types of machine tool

Max.8,X,Y,Z & θ axle

13

Maximum journey & speed of operating platform

650mm×450mm,800mm/s

14

Repetition accuracy of moving platform

≦±1μm

15

Positioning accuracy of moving platform

≦±3μm

Software control unit

16

Laser processing & platform control

Strongsoft, Strongsmart

17

Lead-in format of processing file

Dxf, Plt, DWG, Gebar

18

CCD visual positioning software

AISYS Vision

19

CCD visual positioning accuracy

≦±3μm

Electric unit

20

PLC Controller

Panasonic

21

Vacuum system

Vacuum pump

22

Dedusting & dust-collecting system

Professional dust filter integrated machine

Automatic unit

23

Automatic loading & laying -off system

X/Z axlemovable platform

Installation environment

24

Power supply & regulator power

220V/380V, 5KW

25

Pressure of compressed air

0.6MPa

26

Rank of clean room

10000

27

Ground bearing

 2T/m²

28

Protect nitrogen

High purity nitrogen


Business department head:


Mr chen   18617227855


E-mail :cy@stronglaser.com





Hits:  UpdateTime:2016-06-24 17:45:43  【Printing】  【Close

Business department head:


Mr chen   18617227855


E-mail :cy@stronglaser.com